electrically conductive adhesive

SECrosslink-6061 is two-component, conductive adhesive cured at room temperature, high conductivity, high temperature resistance, impact resistance, high bonding strength, no solvent, etc.
SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process.
SECrosslink-6065 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process.
SECrosslink-5012R low temperature rapid curing, single component, low temperature resistance, good flexibility, good adhesion ability to a variety of materials, aging resistance, environmental protection, no solvent, suitable for printing and FIP process, highly compatible with production line.
SECrosslink-5012 fast curing, single component, low temperature resistance, good flexibility, good adhesion ability to a variety of materials, aging resistance, environmental protection, solvent-free, suitable for printing and dispensing process, highly compatible with production line.
SECrosslink-6062 low-temperature rapid curing, single component, high silver content, low volume resistivity, good adhesion to glass, ceramics, silicon wafers, flexible polymer materials, suitable for screen printing process.
SECrosslink-6064 low-temperature rapid curing, single component, high silver content, low volume resistivity, excellent contact resistance, good adhesion to glass, ceramics, silicon wafers and other materials, can work at 150-200℃ for a long time, suitable for screen printing process.
SECrosslink-6066 low-temperature rapid curing, single component, can work at 200-250℃ for a long time, short-term resistance to 280℃, resistance to heat and humidity aging, suitable for screen printing.
SECrosslink-6068 fast curing, single component, low volume resistivity, excellent contact resistance, good adhesion to various materials, suitable for screen printing process.
SECrosslink-6062r low-temperature rapid curing, single component, high silver content, low volume resistivity, good adhesion to PET, PC, PVC and other flexible film materials, suitable for screen printing process.
SECrosslink-5700 low-temperature rapid curing, printing lines with excellent flatness, no burrs, thin line width, thin thickness, very low volume resistivity, good adhesion to glass, PET and other materials, in line with the EU and other environmental requirements.
SECrosslink-4100 quick drying at low temperature, printing line has excellent flatness, no burr, thin line width, thin thickness, very low volume resistivity, good adhesion to PET, PVC, PC, PU and other flexible materials.
SECrosslink-6260 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices.
SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding.
SECrosslink-6262 high thermal conductivity, high conductivity, low ion content, single component, high temperature resistance, used for high power LED devices, integrated circuits, high power chip bonding.
SECrosslink-7006 has very low resistivity (close to pure silver), high thermal conductivity and excellent bonding strength, which is used for high-power IC devices, high-power LED devices, SiC and GaN high-power devices. Due to low-temperature sintering, it can also be used for PET and other flexible films.
SECrosslink-7007 has very low resistivity (close to pure silver), high thermal conductivity and excellent bonding strength, which is used for high-power IC devices, high-power LED devices, SiC and GaN high-power devices. Due to low-temperature sintering, it can also be used for PET and other flexible films.
SECrosslink-3010 single component, low temperature rapid curing, low surface resistance, mainly used in circuit board packaging, composite material shell, plastic shell, aircraft body electromagnetic wave shielding, suitable for jet and screen printing process.
SECrosslink-3020 single component, low temperature rapid drying, low surface resistance, excellent leveling and wetting of substrate, mainly used in circuit board packaging, composite material shell, plastic shell, electromagnetic wave shielding of aircraft body, suitable for jet and screen printing process.
SECrosslink-7501 fast curing, single component, good thixotropic, low temperature resistance, can be used under the conditions of -30℃ ~ 80℃, flexible and elastic, aging resistance, used for photovoltaic solar energy and other electronic fields.(acrylate system, imbricated)
SECrosslink-7502 fast curing, single component, good thixotropy, low temperature resistance, can be used under the conditions of -30℃ ~ 80℃, flexible and elastic, aging resistance, used for photovoltaic solar energy and other electronic fields.( silicon system, imbricated)
SECrosslink-7503 fast curing, single component, weldability - meets weldability and weldability test, excellent contact resistance, high adhesion, suitable for screen printing process, used in photovoltaic solar energy and other electronic fields.(HJT battery)
SECrosslink-7504 fast curing, single component, excellent contact resistance, high adhesion, suitable for screen printing process, used in photovoltaic solar energy and other electronic fields.(MWT battery)
SECrosslink-8801 UV cured conductive adhesive, low temperature resistance, aging resistance, flexibility, low Tg.
SECrosslink-8802 UV curing conductive adhesive, low temperature resistance, aging resistance, high hardness, high Tg.
SECrosslink-7800 650℃ sintered type, weldable, suitable for glass electrode, ceramic thermal resistance and other areas requiring extreme temperature resistance.
SECrosslink-7900 850℃ sintering type, weldable, suitable for glass electrode, ceramic thermal resistance and other areas requiring extreme temperature resistance.
SECrosslink-5011R fast curing, low shear strength, single component, low temperature resistance, good flexibility, good adhesion to a variety of materials, aging resistance, strong wettability, suitable for filling and sealing curing, suitable for conductive bonding of components that need to be removed.
SECrosslink-6160 low temperature fast curing weldable conductive silver paste, single component, high Tg, high temperature resistance, good weldability - pass the weldability and weldability test, excellent contact resistance, high adhesion, suitable for screen printing process.