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8L Cell phone HDI board PCB
8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1
Added (m.d.y):
10.25.2019 Offer viewed:
285 (hits)
Member Information:
Contact person:
Susie Zhao
Phone:
+86-755-29630063-804
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