Alumina Ceramic PCBs

Loaded with vast industrial knowledge and expertise, we have emerged as a major Manufacturer of Alumina Ceramic PCBs in Wuhan, Hubei, China.
Electronic packaging requires the substrate material to meet the high thermal conductivity, low dielectric constant, and the chip with the thermal expansion coefficient, good processing performance, high mechanical strength requirements. Due to the characteristics of the ceramic substrate coefficient, good heat conductivity, heat resistance, insulation, and chip matched thermal expansion in electronic packaging applications such as LED, CPV, and insulated gate bipolar transistor, laser diode package more widely.

With the continuous development of LED lighting and sensor market and the expansion of scale, the demand for ceramic substrate has also been greatly improved. Especially the use of ceramic laser drilling technology prepared has high precision, vertical graphics package, can be realized through hole metallization, the holes can be large-scale production of single-sided and double-sided ceramic substrate etc., greatly improving the package of high power electronic devices integration.

Product features:
1. The shape of the substrate is unlimited
2. Laser printed 3D routing
3. No mask, fast response
4. Mature technology, environmental protection, pollution-free
5. Customized production, without mold opening, short production cycle