High Density Interconnect PCB

High Density Interconnects pcb (HDI pcb) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market
segments. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit
boards (PCB).
They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

General Information for High density pcb (HDI PCB)

HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

High Density PCB is used extensively in applications and industries including:

● Cell phone ● GPS
● Telecom ● ASemiconductor
● Automotive ● Military
● Medical ● Instrumentation