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Diamond Wheels for Surface Grinding Various Wafer
Diamond Wheels for Surface Grinding Various Wafer
Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond & Resin bond
Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm
Added (m.d.y):
09.29.2020 Offer viewed:
509 (hits)
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