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Soldering carrier materials ricocel

TFUER-T315
* Similar to Ricocel

T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance.

Thickness: 3 mm ~ 50 mm.
Dimension: 1020 x 1220 mm, 1220 x 2440 mm
Color: Black

Added (m.d.y): 01.15.2025

Offer viewed: 287 (hits)

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Contact person:

Max Ho

Phone:

15793858400

Location:

China

Type of offer:

Sell

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