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pic. Type: Double sides board with gold finger Laminate: FR4 Board thickness: 63mil Surface finished: ENIG Copper thickness: 105um (3oz) Solder resist: green color Silkcreen: white color...
pic. Technical description Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics...
15.
China
No
pic. 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: ...
16.
China
No
pic. Technical description Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics...
pic. 6L High density PCB (HDI PCB) for intercom Board dimensions: 110 x 166mm Finished board thickness: 1.2mm Material: FR-4 Tg150 Minimum holes size: 0.1mm Minimum line width/clearance: ...


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