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Type: Double sides board with gold finger
Laminate: FR4
Board thickness: 63mil
Surface finished: ENIG
Copper thickness: 105um (3oz)
Solder resist: green color
Silkcreen: white color...

Technical description Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics...

8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: ...

Technical description Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics...

6L High density PCB (HDI PCB) for intercom
Board dimensions: 110 x 166mm
Finished board thickness: 1.2mm
Material: FR-4 Tg150
Minimum holes size: 0.1mm
Minimum line width/clearance: ...