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pic. Material: Power Device PCB Assembly Layer/Thickness: 6L/1.6 mm Copper Thickness:2 OZ Surface treatment:ENIG Min Line Width: 0.11mm Min Line Space: 0.33mm Min Hole:0.29mm Solder ...
pic. Product type: Rigid-flex board Material: FR4+FCCL Application field: Electronic industry Layer/thickness: 4L/1.6mm Surface treatment: Gold sinking Line space/width: 6/6mil Minimum hole ...


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